Direct Attach Interposers
Nexus Technology recommends direct attach DDR component interposers as a low cost alternate to the target socketed component interposers for oscilloscope applications requiring optimal analog validation of speeds up to DDR3-2133, or for embedded applications, in general. Read more…
Simulation & De-Embedding
S-Parameters are included for target simulation and the creation of de-embedding filters for use with an oscilloscope.
Product Configuration Table
| Nomenclature | Data Width | Interposer Type |
|---|---|---|
| NEX-DDR3MCI96SCDS | x16 | Direct Attach |
If your application requires that you be able to swap out memory components under test, please view our DDR3 96 Ball Oscilloscope Component Interposers.
Available Accessories
| Type | Desc. | Quantity | Nomenclature |
|---|---|---|---|
| Riser | Riser elevates interposer .050″ | 1 | NEX-RSRDDR396 |
| Socket | Memory socket | 1 | NEX-SOCKETDDR396 |
| Solder Balls | Install solder balls on interposer | 1 | NEX-OPT-SOLDERBALLS-EP |
| Solder Balls | Install solder balls on socket | 1 | NEX-OPT-SOLDERBALLS-SK |
Attachment Service
Nexus Technology’s expert attachment service provides a ready-to-go test solution customized to your application. We will attach the interposer and any additional accessories to your application’s target. We can also power-on and test your application to confirm functionality. Please contact us for more information.
Mechanical Outline
