Low power double-data rate fourth-generation (LPDDR4 and LPDDR4X) mobile memory technologies are developed by the Joint Electronic Devices Engineering Council (JEDEC) for use in handheld devices or applications where low-power and small size is critical.
Nexus Technology offers high quality and high fidelity interposers, enabling the industry to confidently and accurately gain access to LPDDR4(X) mobile memory buses for debug and compliance verification. … more…
Packaging/Modules
LPDDR4 and LPDDR4X mobile memory is available in standard Ball-Grid-Array (BGA) component packages. Standard BGA packages are soldered directly to the printed circuit board (PCB). Interposers are available for component packages detailed below:
| Interposers | Options | ||||
|---|---|---|---|---|---|
| Oscilloscope | MA Instrument | ||||
| Package (ChxDb) | EdgeProbe™ | Direct Attach | Logic Compliance | Riser | Component Socket |
| 144 Ball (x16) | * | * | * | No | No |
| 149 Ball (2×16) | * | ✓(XH) | ✓ | Yes | No |
| 200 Ball (2×16) | ✓ (XH) | ✓ (XH) | ✓ | Yes | Yes |
| 254 Ball (2×16) | * | ✓ (XH) | ✓ | Yes | Yes |
| 272 Ball (4×16) | ✓ | ✓ | ✓ | Yes | Yes |
| 366 Ball (4×16) | * | ✓ | ✓ | Yes | Yes |
| 376 Ball (4×16) | * | * | * | No | No |
| 432 Ball (4×16) | * | ✓(XH) | ✓ | Yes | No |
| 556 Ball | Contact Nexus | Contact Nexus | Contact Nexus | Yes | No |
| Custom | Custom designs are also available. Please contact us. | ||||
* If you don’t see what you need, please contact us for the most up to date information.
(XH) XH Series
XH Series
Nexus Technology’s XH Series interposers bring new enhancements to the EdgeProbe™ and Direct Attach types of memory component interposers that maintain signal integrity across the interposer path as well as provide for extremely high-fidelity oscilloscope probe points for both leading edge and emerging memory technologies.
Attachment Service
Nexus Technology’s expert attachment service provides a ready-to-go test solution customized to your application. We will attach the interposer and any additional accessories to your application’s target. We can also power-on and test your application to confirm functionality.
More Information on Interposer Types
Electrical Analysis
Electrical analysis is enabled by using either an EdgeProbe, High Density, or Socketed interposer to capture memory activity on an oscilloscope. The oscilloscope is then used to debug, analyze, and verify the analog characteristics of your design. Presenting an accurate representation of the signals under test to the oscilloscope is critical. Nexus interposers provide an unobtrusive interconnect and accurate signal to your oscilloscope. Learn more…
Logic / Compliance Analysis
Logic analysis is performed using a logic / compliance interposer to capture memory activity on a logic or memory analyzer. The logic or memory analyzer is then used to debug, analyze, and verify the logic (basic protocol) of your design. Compliance analysis uses the same interposers to capture activity on a memory analyzer. The memory analyzer is then used to debug, analyze, margin test, performance analyze, and verify the memory protocol. Learn more…
Product List
- LPDDR4 149 Ball Compliance Interposer
- LPDDR4 200 Ball Compliance Interposer
- LPDDR4 200 Ball XH Series Direct Attach Interposer
- LPDDR4 200 Ball XH Series EdgeProbe Interposers
- LPDDR4 254 Ball Compliance Interposer
- LPDDR4 254 Ball XH Series Direct Attach Interposer
- LPDDR4 272 Ball Compliance Interposer
- LPDDR4 272 Ball Direct Attach Interposer
- LPDDR4 272 Ball EdgeProbe™ Interposer
- LPDDR4 366 Ball Compliance Interposer
- LPDDR4 366 Ball Direct Attach Interposer
- LPDDR4 432 Ball Compliance Interposer
- LPDDR4-149 Ball XH Series Direct Attach Interposer
- LPDDR4-432 Ball XH Series Direct Attach Interposer